Project Description

Electronic Assembly Inspection Equipment

Description:

I would like to learn more about surface-mount technology (SMT)/Semiconductor inspection and capabilities of technologies for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Automated X-ray Inspection (AXI). In particular, I would like to speak with professionals who can provide an overview of the decision making process for SPI/AOI/AXI equipment, which OEM best integrates their products across inspection and assembly, and innovations/trends in the industry.